Hybrid die-attach Solution

Hybrid die-attach represents a convergence of advanced SMT and IC technologies. Equipment serving this market must be extremely flexible to bond many different components while applying two or more different epoxies, in a single pass. It must process the smallest to the largest, and also ultra-thin, die. Various single-pass component presentation methods are required and the equipment must work with many different substrate types. Key bond process parameters such as placement accuracy, bond-line thickness, die tilt, epoxy coverage and fillet, must be met.

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